Vacuum Furnace
Vertical Vacuum Furnace 1100C High Temperature 8 Inch Quartz Chamber Water Cold Flange System
Item Number: TU-QF02
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Product Overview


This high-temperature vertical vacuum-sealed system represents the pinnacle of thermal processing for material science and semiconductor research. Engineered to facilitate precise annealing and calcination processes, this unit features a specialized vertical orientation that optimizes space while providing a uniform thermal environment for larger substrates. The equipment is built around a heavy-duty quartz chamber capable of reaching operating temperatures up to 1100°C under ambient pressure, making it an essential tool for laboratories focused on high-purity material development and advanced electronic components.
The system is specifically designed to accommodate semiconductor wafers up to 8 inches in diameter, offering a versatile platform for both vacuum-environment processing and controlled gas atmosphere experiments. By integrating a sophisticated stainless steel sealing flange with integrated water cooling, the system maintains structural integrity and seal longevity even during prolonged high-heat cycles. This equipment is the preferred choice for industrial R&D centers and academic institutions requiring a reliable, repeatable, and high-capacity thermal processing solution for delicate substrates.
Built for reliability under demanding industrial conditions, this thermal processing unit utilizes high-quality resistance wire and advanced refractory materials to ensure consistent performance. Every component, from the NRTL-certified digital controller to the dual-silicone O-ring sealing mechanism, is selected to provide procurement teams and lead engineers with confidence in the system’s long-term operational stability. This unit delivers the robustness required for 24/7 research environments where precision and uptime are critical metrics for success.
Key Features
- High-Capacity Quartz Chamber: The system features a large-diameter GE214 quartz tube with an 8-inch outer diameter, specifically dimensioned to process semiconductor wafers and large-batch material samples with unparalleled clarity and purity.
- Advanced Water-Cooled Sealing Flange: A built-in water-cooling jacket protects the vacuum sealing assembly from thermal degradation, allowing the stainless steel flange to maintain a hermetic seal at temperatures exceeding 1100°C without melting the silicone O-rings.
- Precision PID Temperature Control: The NRTL-certified digital controller offers 30 programmable segments for ramping, cooling, and dwelling, ensuring ±1°C accuracy for sensitive thermal profiles required in semiconductor fabrication.
- Superior Vacuum Performance: Engineered to work seamlessly with high-vacuum pump stations, this unit can achieve vacuum levels as deep as 10^-5 Torr when utilizing a turbopump, essential for oxygen-sensitive calcining and annealing tasks.
- Robust Heating Element Design: Utilizing high-grade Ni-Cr-Al resistance wire, the system provides rapid heating rates up to 20°C per minute while maintaining excellent durability across repetitive thermal cycles.
- Integrated Safety and Alarms: The equipment includes built-in over-temperature and thermocouple failure alarms, providing automated protection for both the furnace and the valuable materials being processed inside.
- Flexible Atmosphere Management: Equipped with high-precision needle valves and multiple gas inlet/outlet ports, the system allows for the precise introduction of inert or reactive gases during the heating process.
- Scalable Monitoring Options: The unit includes a mechanical vacuum gauge as standard, with options for gas-independent digital vacuum gauges and PC communication ports for real-time data logging and remote monitoring.
- Heavy-Loading Capability: Designed to support up to 40kg of material weight, the vertical chamber architecture is reinforced to handle industrial-grade sample loads without compromising structural integrity.
Applications
| Application | Description | Key Benefit |
|---|---|---|
| Semiconductor Wafer Annealing | Processing of wafers up to 8 inches to repair lattice damage after ion implantation. | Precise ±1°C control ensures uniform electrical characteristics across the wafer surface. |
| Aerospace Material Calcining | High-temperature oxidation and calcination of ceramic matrix composites under vacuum. | Maintains high purity via oxygen-free environments, preventing contamination of critical alloys. |
| Thin Film Deposition Research | Preparation of substrates and post-deposition heat treatment for advanced solar cells. | Large 190mm ID chamber accommodates multiple substrates simultaneously for high-throughput testing. |
| Solid-State Battery R&D | Sintering of ceramic electrolytes and anode materials in controlled gas atmospheres. | Reliable gas inlet/outlet systems allow for exact chemical composition control during sintering. |
| Electronic Component Aging | Stress testing of sensors and high-power electronic modules under extreme thermal conditions. | Vertical orientation allows for specialized jigging and fixture setups that minimize component deformation. |
| Vacuum Degassing | Removal of trapped gases from specialty glasses or metal powders prior to casting. | High vacuum capability (10^-5 Torr) ensures complete removal of volatiles for superior material density. |
Technical Specifications
| Specification | Details for TU-QF02 |
|---|---|
| Voltage | Single-phase 208 - 240 VAC / 50/60Hz |
| Maximum Power | 3 KW (25 A breaker installed) |
| Max. Working Temperature (Ambient) | < 1100°C |
| Max. Working Temperature (Vacuum) | < 1000°C |
| Optional Max Temperature | 1150°C (with upgraded GE214 quartz tube) |
| Heating Rate | Recommended: 10°C/ min; Max: < 20°C/ min |
| Heating Elements | Ni-Cr-Al resistance wire |
| Quartz Tube Dimensions | Ø200 × Ø190 × H425 mm |
| Maximum Loading Capacity | 40 Kg |
| Effective Heating Area | Ø240 × H245 mm |
| Flange Assembly | Stainless steel with dual high-temperature silicone O-rings and water cooling jacket |
| Gas Management | One 1/4" gas inlet and one outlet with needle valves |
| Vacuum Port | Built-in KF25 port for pump connection |
| Vacuum Level (Mechanical Pump) | 10^-2 Torr within 30 minutes (without thermal block) |
| Vacuum Level (Turbopump) | 10^-5 Torr within 30 minutes (at 900°C with Quartz Thermal Block) |
| Temperature Controller | 30-segment PID digital controller, NRTL-certified |
| Temperature Accuracy | ± 1 ºC (Standard); ± 0.1 ºC (Eurotherm Option) |
| Vacuum Gauge | Mechanical Gauge (-0.1 to 0.15 Mpa); Digital Pressure Gauge optional |
| Standards Compliance | CE Certified (NRTL/CSA available on request) |
| Cooling Requirement | 16 L/min water flow for flange protection |
| Communication | Default DB9 PC communication port included |
Why Choose TU-QF02
- Precision Engineered for Scale: Unlike standard laboratory furnaces, this system provides a massive 8-inch diameter processing zone, enabling direct transition from small-sample R&D to pilot-scale production without changing thermal parameters.
- Superior Thermal Management: The integration of a water-cooled flange system ensures that even at maximum temperatures, the sealing integrity remains uncompromised, extending the life of consumables and reducing maintenance costs significantly.
- Adaptable Vacuum Architecture: Whether you require basic mechanical vacuum levels or ultra-high vacuum environments via turbomolecular pumps, the system's flexible KF25 interface and high-grade stainless steel valves support your specific process needs.
- Certified Safety and Reliability: With NRTL-certified controllers and CE compliance, this equipment meets the stringent safety and quality standards required by modern industrial manufacturing and high-stakes research facilities.
- Customizable Control Options: From Eurotherm high-precision controllers to digital gas mixing stations, we provide the hardware modularity necessary to tailor the system to specialized material processing protocols.
Our technical team is ready to assist you with a custom configuration or a formal quotation for your facility. Contact us now to discuss how this vertical vacuum system can enhance your thermal processing capabilities.
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