1200C Max Compact Auto-Sliding PECVD Furnace with 2 Inch Tube and Vacuum Pump

Product Overview

This high-performance thermal processing system is a compact, plasma-enhanced chemical vapor deposition (PECVD) solution designed specifically for advanced material research and thin-film development. By integrating a powerful RF plasma generator with a precision split tube furnace, the equipment enables researchers to achieve superior film quality at significantly lower temperatures than conventional CVD processes. The core value proposition lies in its unique slidable mechanism, which allows the heating zone to be moved rapidly to the sample location, facilitating instant high-temperature exposure and accelerated cooling cycles for unprecedented control over microstructure and phase formation.

Primarily engineered for laboratory R&D and industrial material science, the system is ideal for depositing a variety of films, including silicon oxides, nitrides, and amorphous silicon. Its versatility makes it a cornerstone for laboratories specializing in semiconductors, photovoltaics, and nanotechnology. The compact footprint allows for seamless integration into existing lab environments without sacrificing the high-vacuum and high-temperature capabilities required for professional-grade material synthesis.

Reliability is at the heart of this unit’s design. Built with industrial-grade components, including a robust 13.56 MHz RF generator and high-purity quartz processing tubes, the system delivers consistent performance under demanding duty cycles. The integration of high-vacuum flanges and a dual-stage vacuum pump ensures a clean, controlled environment for sensitive chemical vapor deposition processes, providing researchers with the confidence to execute complex, multi-step experimental protocols with repeatable accuracy.

Key Features

• Integrated Auto-Sliding Mechanism: The furnace is mounted on a heavy-duty precision rail system, allowing for the rapid translation of the heating zone. This engineering allows for instantaneous heating and cooling of the sample, which is critical for controlling grain growth and quenching metastable phases.
• High-Efficiency RF Plasma Generation: Equipped with a 300W RF generator operating at 13.56 MHz, the system generates a stable plasma discharge. This allows for chemical reactions to occur at reduced substrate temperatures, protecting heat-sensitive materials and reducing thermal stress in the deposited films.
• Precision Temperature Management: The equipment utilizes a 300-watt heating system controlled by a 30-segment programmable digital PID controller. This ensures ±1°C accuracy and allows for complex thermal profiles, including ramp, soak, and cooling phases, to be executed automatically.
• Superior Vacuum Integrity: Featuring stainless steel 304 vacuum flanges with double O-ring seals, the system achieves a high-vacuum state of 3 x 10E-3 torr. The inclusion of a digital Pirani gauge and high-quality needle valves allows for meticulous control over the processing atmosphere.
• Split Furnace Design: The furnace body is designed as a split-hinge unit, which facilitates easy loading and unloading of samples, quick replacement of the processing tube, and faster natural cooling when the sliding mechanism is not in use.
• Enhanced Stoichiometry Control: By manipulating plasma power, gas flow rates, and pressure, users can exercise precise control over the chemical composition and film stress of the deposited materials, making it a highly flexible tool for specialized coating applications.
• Robust Safety and Compliance: The system is CE certified and incorporates protective features such as an oil mist eliminator for the vacuum pump and options for oxygen monitoring to prevent unwanted oxidation during sensitive deposition cycles.

Applications

Technical Specifications

Why Choose This PECVD System

• Unmatched Thermal Versatility: The combination of an auto-sliding rail and plasma-enhanced deposition allows for a broader experimental window than standard furnaces, supporting both rapid thermal processing and low-temperature chemical reactions.
• Precision Engineering: Every component, from the 13.56 MHz RF generator to the stainless steel vacuum assembly, is selected for its ability to maintain rigorous industrial tolerances over long-term operation.
• Comprehensive Integration: This system arrives as a complete solution including the furnace, plasma generator, vacuum pump, and monitoring hardware, reducing setup time and ensuring component compatibility.
• Scalable and Customizable: With options for multi-channel gas mixing stations, liquid vaporization systems, and advanced software control, the unit can be tailored to meet specific research budgets and technical requirements.
• Proven Reliability: Built to exceed laboratory standards, this equipment is supported by a global service network and a commitment to high-quality manufacturing, ensuring your R&D investment is protected.

Contact our technical sales team today to request a quote or to discuss how we can customize this PECVD system for your specific thin-film deposition requirements.