950C Rapid Thermal Processing Furnace for 12 Inch Wafer CSS Coating with Rotating Substrate Holder

RTP Furnace

950C Rapid Thermal Processing Furnace for 12 Inch Wafer CSS Coating with Rotating Substrate Holder

Item Number: TU-RT33

Maximum Working Temperature: 950°C Wafer Compatibility: Up to 12 Inch Diameter Vacuum Level: 10-5 Torr (via Turbopump)
Quality Assured Fast Delivery Global Support
Request Quote

Shipping: Contact us to get shipping details Enjoy On-time Dispatch Guarantee.

Product Overview

Product image 1

Product image 3

This high-performance rapid thermal processing (RTP) and close-spaced sublimation (CSS) system represents the pinnacle of large-scale laboratory and pilot-line thermal processing. Designed specifically for the deposition of high-quality thin films and the annealing of 12-inch wafers, the equipment integrates dual-zone infrared heating with a sophisticated rotating substrate architecture. By providing a controlled environment for complex material transitions, this unit enables researchers and industrial engineers to achieve repeatable, high-fidelity results in the development of next-generation solar cells and semiconductor devices.

The system is engineered to handle demanding industrial R&D workflows, targeting advanced applications in photovoltaics, such as Cadmium Telluride (CdTe), Antimony Selenide (Sb2Se3), and Perovskite solar cells. Its primary value proposition lies in its ability to manage large-format 12-inch substrates while maintaining the thermal uniformity and rapid ramp rates required for modern thin-film synthesis. Whether utilized for rapid thermal annealing or vapor-assisted solution processes, the equipment provides a robust platform for scaling material science innovations from fundamental research to production-ready specifications.

Built with industrial-grade components and a heavy-duty stainless steel vacuum chamber, the unit ensures long-term operational reliability under high-vacuum and high-temperature conditions. The integration of precision control electronics and a water-cooled thermal management system allows for continuous operation without compromising the integrity of the internal components. This system is the ideal choice for facilities requiring a combination of large-wafer compatibility, rapid thermal response, and the high-vacuum precision necessary for high-efficiency semiconductor manufacturing.

Key Features

  • Dual-Zone IR Heating Architecture: The system utilizes two independent groups of halogen infrared heaters (top and bottom) capable of reaching 950ºC. This dual-zone configuration allows for precise control of the temperature gradient, which is critical for close-spaced sublimation (CSS) processes.
  • Precision Substrate Rotation: A built-in 12-inch wafer holder features an adjustable rotation mechanism (1 - 10 RPM). This ensures exceptional film thickness uniformity and structural consistency across the entire surface of large-format substrates.
  • Rapid Thermal Performance: Engineered for speed, the unit can achieve heating rates up to 8ºC/s and cooling rates up to 20ºC/s. This rapid response minimizes thermal budget and allows for the precise quenching of phases in material synthesis.
  • High-Vacuum Integrity: The 20-inch ID stainless steel chamber is designed to reach vacuum levels of 10^-5 Torr via a turbomolecular pump. This clean, low-pressure environment is essential for preventing oxidation and ensuring the purity of deposited thin films.
  • Advanced PLC and Touchscreen Control: All operational parameters, including temperature profiles, vacuum levels, rotation speeds, and flange positioning, are managed through a centralized PLC system with a user-friendly touchscreen interface.
  • Thermal Uniformity Enhancement: Graphite plates are strategically positioned over the IR heaters to serve as thermal buffers, smoothing out potential hot spots and ensuring a perfectly uniform heat distribution across the 12-inch processing area.
  • Integrated Safety and Cooling: A 58L/min circulating water chiller is included to maintain the temperature of the heater jackets and chamber walls, ensuring operator safety and protecting the vacuum seals during high-temperature cycles.
  • In-Situ Observation Windows: Dual 60mm diameter quartz windows allow for real-time visual monitoring of the deposition process or sample condition without breaking the vacuum or disturbing the thermal environment.
  • Independent Temperature Regulation: Equipped with dual Eurotherm 3000 series digital controllers, the system offers 24-segment programming for both the top and bottom heaters, providing ±0.1ºC accuracy.
  • Built-in Vapor Baffle: An air-tight sliding baffle is integrated into the chamber to block evaporation sources under high vacuum, allowing for precise control over the start and end of the deposition process.

Applications

Application Description Key Benefit
CdTe Solar Cell Synthesis High-efficiency Close Spaced Sublimation (CSS) for Cadmium Telluride thin-film deposition. Superior grain growth and optimized interface quality for PV efficiency.
Semiconductor Annealing Rapid thermal processing (RTP) of 12-inch silicon or compound semiconductor wafers. Reduced thermal budget and precise activation of dopants without diffusion.
Perovskite Photovoltaics Vapor-assisted solution processes and thermal annealing of large-area perovskite layers. Improved film morphology and enhanced stability of the light-harvesting layer.
Sb2Se3 Thin-Film R&D Rapid thermal evaporation of Antimony Selenide for one-dimensional ribbon oriented photovoltaics. Control over crystal orientation and reduction of grain boundary defects.
CVD/Physical Vapor Deposition General high-vacuum vapor deposition for advanced material science research. Versatile platform for exploring new thin-film compositions and structures.
Industrial Pilot Production Scaling up laboratory recipes to 12-inch formats for industrial feasibility testing. Seamless transition from R&D to large-scale semiconductor manufacturing processes.

Technical Specifications

Feature Specification Details (Model: TU-RT33)
Working Temperature Max. 950ºC for each heater; Max. ΔT between heaters ≤ 300ºC
Heating Rate < 8ºC/s (single heater operation); Max. instantaneous rate up to 1200ºC/min
Cooling Rate < 10ºC/s to 20ºC/s (range 600ºC to 100ºC)
Substrate Capacity Up to 12" Diameter circular wafers
Substrate Rotation Adjustable 1 - 10 RPM via top-mounted holder
Heating Elements Two 12" IR Halogen heating plates (Top & Bottom)
Thermal Buffer Graphite plates included for enhanced heating uniformity
Vacuum Chamber Stainless Steel; ID 500mm x H 460mm (20" ID)
Vacuum Level 10^-5 Torr (with Turbopump) or 10^-2 Torr (with Mechanical Pump)
Temperature Control Dual Eurotherm 3000 controllers; 24 programmable segments; ±0.1ºC accuracy
Logic Control Touch Screen Computer via PLC; supports 10 pre-set programs
Observation Ports Two 60mm diameter quartz windows
Power Requirements 208 - 240VAC, 3-Phase, 50/60 Hz (380VAC available); 60 KW Max
Cooling System 58L/min circulating water chiller (Included)
Dimensions L 1450 mm x W 1250 mm x H 2100 mm
Weight Approx. 500 Kg
Compliance CE Certified; UL/MET/CSA available upon request

Why Choose TU-RT33

  • Unmatched Thermal Precision: The combination of dual Eurotherm controllers and IR halogen technology allows for instantaneous thermal response and extreme accuracy, ensuring your thin-film processes are perfectly repeatable.
  • Scalability for Industrial Standards: While many RTP systems are limited to small coupons, this unit handles full 12-inch wafers, bridging the gap between university research and industrial semiconductor production standards.
  • Robust Vacuum Performance: The heavy-duty stainless steel chamber and high-speed turbomolecular pumping system provide the ultra-clean environment necessary for high-purity semiconductor and solar cell applications.
  • Comprehensive Process Control: With PLC-integrated management of rotation, temperature, and vacuum, the system minimizes human error and provides detailed data logging for quality assurance and academic publication.
  • Proven Reliability in High-Impact Research: This platform is trusted by leading institutions for research published in top-tier journals like Nature Photonics, proving its capability in cutting-edge material science.

Contact our technical sales team today to request a formal quotation or to discuss a customized configuration tailored to your specific thin-film research requirements.

View more faqs for this product

REQUEST A QUOTE

Our professional team will reply to you within one business day. Please feel free to contact us!

Related Products

Rapid Thermal Processing Atmosphere Controlled Bottom Loading Furnace 1100C with 50C Per Second Heating Rate for Wafer Annealing

Rapid Thermal Processing Atmosphere Controlled Bottom Loading Furnace 1100C with 50C Per Second Heating Rate for Wafer Annealing

Achieve peak efficiency with this 1100°C bottom loading rapid thermal processing furnace featuring 50°C/s heating rates and automated atmosphere control. Perfect for high-throughput single-atom catalysis and precise six-inch semiconductor wafer annealing in advanced research environments.

Two Zones CSS Furnace for Rapid Thermal Processing Thin Film Coating 3 Inch Diameter 650C

Two Zones CSS Furnace for Rapid Thermal Processing Thin Film Coating 3 Inch Diameter 650C

This high-performance two-zone rapid thermal processing furnace enables precise close spaced sublimation and thin-film coating up to 650°C. Engineered for material science R&D, it offers exceptional heating rates, dual-zone control, and robust vacuum capabilities for advanced solar cell research.

Rapid Thermal Processing Furnace 1100C Atmosphere Controlled Bottom Loading RTP System for Wafer Annealing and Catalysis Research

Rapid Thermal Processing Furnace 1100C Atmosphere Controlled Bottom Loading RTP System for Wafer Annealing and Catalysis Research

This 1100°C bottom loading RTP furnace delivers ultra-fast 50°C/s heating for wafer annealing and catalysis. Featuring automated atmosphere control and robotic integration, it ensures high-throughput precision for demanding industrial R&D and material science applications with consistent reliability and unmatched performance.

High Temperature 800C Rapid Thermal Processing Furnace with Rotating Sample Holder for Close Spaced Sublimation and Thin Film Solar Cell Research

High Temperature 800C Rapid Thermal Processing Furnace with Rotating Sample Holder for Close Spaced Sublimation and Thin Film Solar Cell Research

This advanced 800°C CSS and RTP furnace features dual halogen heaters and a rotating substrate holder for 5x5" wafers. Designed for rapid thermal processing of thin-film photovoltaics, it offers precise control, high uniformity, and superior cooling performance.

1200C Tube Furnace with Internal Magnetic Sample Sliding for Direct Vaporizing Deposition and Rapid Thermal Processing

1200C Tube Furnace with Internal Magnetic Sample Sliding for Direct Vaporizing Deposition and Rapid Thermal Processing

This professional 1200C tube furnace features a manual magnetic sample sliding mechanism specifically engineered for direct vaporizing deposition and rapid thermal processing. It ensures precise thermal control and consistent material growth for demanding research and industrial material science applications.

High Temperature Vacuum Lamination Hot Press Furnace Machine for Semiconductor Wafer Bonding and Advanced Composite Thermal Processing

High Temperature Vacuum Lamination Hot Press Furnace Machine for Semiconductor Wafer Bonding and Advanced Composite Thermal Processing

This advanced vacuum hot press lamination machine integrates hydraulic precision with controlled thermal environments for oxygen-sensitive materials. Engineered for semiconductor wafer bonding and thin-film transformations, it delivers exceptional pressure uniformity and temperature accuracy for R&D and industrial manufacturing.

1200C Sliding Tube Furnace for Rapid Thermal Processing and CVD Graphene Growth with 100mm OD Capacity

1200C Sliding Tube Furnace for Rapid Thermal Processing and CVD Graphene Growth with 100mm OD Capacity

Accelerate your research with this 1200°C sliding tube furnace designed for rapid thermal processing and CVD applications. Featuring high-precision PLC control and a motorized sliding rail for ultra-fast heating and cooling cycles in advanced material science and industrial R&D laboratories.

Rapid Thermal Processing RTP Atmosphere Controlled Bottom Loading Furnace 1100C High Throughput 50C per Second Heating Rate

Rapid Thermal Processing RTP Atmosphere Controlled Bottom Loading Furnace 1100C High Throughput 50C per Second Heating Rate

Maximize R&D efficiency with this 1100C bottom loading RTP furnace, featuring ultra-fast 50C/s heating and atmosphere control. This high-throughput system integrates with robotic arms for automated single-atom catalysis and precise 6-inch wafer annealing applications.

1200C High Temperature 5 Inch Sliding Tube Furnace for Rapid Thermal Processing RTP and Wafer Annealing

1200C High Temperature 5 Inch Sliding Tube Furnace for Rapid Thermal Processing RTP and Wafer Annealing

Accelerate your material research with this 1200C sliding tube furnace designed for rapid thermal processing. Featuring a 5 inch quartz tube and dual PID controllers, it delivers precise heating and cooling rates for advanced semiconductor applications.

High Temperature Tube Furnace 1500C with Sliding Flanges and 50mm OD for Rapid Thermal Processing Fast Heating and Cooling

High Temperature Tube Furnace 1500C with Sliding Flanges and 50mm OD for Rapid Thermal Processing Fast Heating and Cooling

Achieve rapid thermal processing with this 1500C max tube furnace featuring manual sliding flanges for accelerated heating and cooling. Engineered for material science research, this high-precision system offers exceptional vacuum performance and dual-controller monitoring for demanding laboratory applications.

Compact Atmosphere Controlled Rapid Thermal Processing RTP Furnace with 4 Inch ID Quartz Tube 1100C

Compact Atmosphere Controlled Rapid Thermal Processing RTP Furnace with 4 Inch ID Quartz Tube 1100C

Enhance semiconductor research with this compact atmosphere controlled RTP furnace. Featuring a 4-inch quartz tube and 1100°C capacity, it offers 50°C/second heating for precision annealing, CVD, and high-throughput material processing.

Automated Sliding Tube Furnace for Fast Heating and Cooling 2 Inch OD 1100C Max

Automated Sliding Tube Furnace for Fast Heating and Cooling 2 Inch OD 1100C Max

Optimize material research with this high-performance automated sliding tube furnace. Delivering ultra-fast 100°C per minute heating and cooling, this 1100°C system ensures precise thermal processing for semiconductors, nanotechnology, and industrial R&D applications requiring rapid thermal cycling.

Rapid Thermal Processing Sliding Tube Furnace with 4 Inch OD Quartz Tube and 900C IR Heating

Rapid Thermal Processing Sliding Tube Furnace with 4 Inch OD Quartz Tube and 900C IR Heating

Optimize material synthesis with this 900C Max Sliding RTP Tube Furnace. Engineered for rapid IR heating at 50C/s and automated cooling, it provides precise control for graphene, carbon nanotube, and perovskite solar cell research applications.

900 ºC Max Sliding RTP Tube Furnace with Rapid IR Heating and 4 Inch OD Quartz Tube

900 ºC Max Sliding RTP Tube Furnace with Rapid IR Heating and 4 Inch OD Quartz Tube

Maximize R&D efficiency with this 900°C sliding RTP tube furnace featuring rapid IR heating, 50°C/s ramp rates, and automated cooling for graphene growth, CNT synthesis, and advanced semiconductor wafer annealing in vacuum or atmospheric conditions.

High Temperature Bottom Loading Box Furnace for Rapid Thermal Processing 1700C 40L Capacity

High Temperature Bottom Loading Box Furnace for Rapid Thermal Processing 1700C 40L Capacity

Professional 1700C bottom loading box furnace delivers rapid heating and cooling for advanced material research. Featuring automated loading and high-purity insulation, this system ensures precision thermal processing in demanding industrial laboratories and research facilities globally. Reliable quality.

Two Zone Rotary Tube Furnace for Powder CVD Coating and Core Shell Material Synthesis 1100C

Two Zone Rotary Tube Furnace for Powder CVD Coating and Core Shell Material Synthesis 1100C

Optimize powder processing with this high-performance 1100C two-zone rotary tube furnace. Specifically engineered for CVD coating and core-shell synthesis, it features a five-inch quartz tube and mixing blades to ensure exceptional thermal uniformity and consistent material batch production.

Vertical Vacuum Furnace 1100C High Temperature 8 Inch Quartz Chamber Water Cold Flange System

Vertical Vacuum Furnace 1100C High Temperature 8 Inch Quartz Chamber Water Cold Flange System

Advanced 1100C vertical vacuum furnace features an 8 inch quartz chamber and water cooled flange for semiconductor wafer processing. Achieve high performance vacuum levels and precision thermal control for rigorous material research industrial annealing and calcining applications today.

Dual Tube 100mm 80mm CVD Sliding Furnace with 4 Channel Gas Mixing and Vacuum System

Dual Tube 100mm 80mm CVD Sliding Furnace with 4 Channel Gas Mixing and Vacuum System

This dual tube CVD sliding furnace features a 100mm exterior and 80mm interior tube design for flexible electrode research. Integrated with a 4-channel gas mixing station and vacuum system, it enables rapid thermal processing and precise graphene growth.

1200°C Bottom Loading Vacuum Furnace with Rapid Gas Cooling and 8.6 Inch Diameter Quartz Chamber

1200°C Bottom Loading Vacuum Furnace with Rapid Gas Cooling and 8.6 Inch Diameter Quartz Chamber

Advanced 1200°C bottom-loading vacuum furnace designed for precision material research, featuring rapid gas quenching and dual-zone PID control. This industrial-grade system ensures superior thermal uniformity and vacuum integrity for demanding R&D environments and high-purity processing applications.

High Temperature Compact Automatic Bottom Loading Furnace with Rapid Cooling for Autonomous Material Research

High Temperature Compact Automatic Bottom Loading Furnace with Rapid Cooling for Autonomous Material Research

Boost R&D productivity with this 1500C compact automatic bottom loading furnace featuring rapid cooling and automation compatibility for glovebox integration or robotic workflows in advanced industrial laboratories and material science research centers seeking premium precision thermal processing solutions today.

Related Articles